Waveguide mode expander having non-crystalline silicon features

ABSTRACT

A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of Ser. No. 16/428,193, filed May 31,2019, entitled “Waveguide Mode Expander Having Non-Crystalline SiliconFeatures,” which is a continuation of U.S. patent application Ser. No.15/980,536, filed May 15, 2018, entitled “Method Of Modifying Mode SizeOf An Optical Beam, Using A Waveguide Mode Expander HavingNon-Crystalline Silicon Features,” now U.S. Pat. No. 10,345,521, issuedJul. 9, 2019, which application is a continuation of U.S. patentapplication Ser. No. 15/487,918, filed Apr. 14, 2017, entitled“Waveguide Mode Expander Having An Amorphous-Silicon Shoulder,” now U.S.Pat. No. 10,001,600, issued Dec. 7, 2017, which is a divisional of U.S.patent application Ser. No. 14/722,983, filed May 27, 2015, entitled“Waveguide Mode Expander Having An Amorphous-Silicon Shoulder,” now U.S.Pat. No. 9,658,401, issued Dec. 3, 2015, which claims priority to U.S.Provisional Application No. 62/003,404, filed May 27, 2014, entitled“Waveguide Mode Expander Using Polycrystalline Silicon,” and U.S.Provisional Application No. 62/044,867, filed Sep. 2, 2014, entitled“Waveguide Mode Expander Having An Amorphous-Silicon Base Layer.” Thedisclosures of all of the aforementioned patent applications areincorporated by reference in their entireties for all purposes. U.S.patent application Ser. No. 15/980,536 is also a divisional of U.S.patent application Ser. No. 14/722,970, filed May 27, 2015, entitled“Waveguide Mode Expander Using Amorphous Silicon,” now U.S. Pat. No.9,885,832, issued Dec. 3, 2015, the disclosure of which is alsoincorporated by reference in its entirety for all purposes.

BACKGROUND

This application relates to optical waveguides. More specifically, andwithout limitation, to coupling a silicon waveguide to an optical fiber.

Photonic devices, including optical waveguides, are being integrated onsemiconductor chips. Photonic devices integrated on semiconductor chipsare often designed for use in fiber-optic communication systems.

BRIEF SUMMARY

This application discloses embodiments of a mode expander for coupling asmaller optical mode, such as a fundamental mode in a semiconductorwaveguide, to a larger optical mode, such as a fundamental mode in anoptical fiber.

A waveguide mode expander comprises a substrate, a waveguide disposed onthe substrate, a shoulder, and a ridge. The waveguide disposed on thesubstrate comprises crystalline silicon. The shoulder is opticallycoupled with the waveguide, wherein: the shoulder is disposed on thesubstrate; and the shoulder comprises non-crystalline silicon. The ridgecomprises non-crystalline silicon; the ridge is disposed on theshoulder, such that the shoulder is between the ridge and the substrate;and the ridge has a narrower width than the shoulder, wherein the ridgeand the shoulder are configured to guide and expand an optical beampropagating from the waveguide and through the shoulder and the ridge.

In some embodiments, the waveguide has a rectangular cross section. Insome embodiments, the ridge comprises a plurality of stages; at a crosssection of the waveguide mode expander, each stage of the plurality ofstages has a different width; and a first stage of the plurality ofstages, which is closer to the shoulder, has a wider width than a secondstage of the plurality of stages, which is farther from the shoulderthan the first stage. In some embodiments, the first stage is thinnerthan the second stage. In some embodiments, the non-crystalline siliconis amorphous silicon. In some embodiments, the plurality of stages has anumber of stages; and the number of stages is three. In someembodiments, the waveguide mode expander further comprises a cladding(e.g., SiO2) covering the ridge and the shoulder. The ridge expands theoptical beam by tapering from a narrower width near an input end to awider width near an output end. In some embodiments, the substratecomprises buried-oxide layer and a handle layer; the buried-oxide layeris disposed between the shoulder and the handle layer; the buried-oxidelayer is disposed between the waveguide and the handle layer; and theburied-oxide layer acts as a cladding layer to the shoulder and thewaveguide. In some embodiments, the waveguide mode expander furthercomprises an interface between the shoulder and the waveguide, whereinthe interface forms a plane that is angled with respect to an opticalpath of the waveguide such that the plane is not orthogonal to anoptical path.

In some embodiments, a method for manufacturing a waveguide modeexpander is described, the method comprising: providing a substratehaving a device layer disposed on the substrate; applying photoresist onthe device layer; etching the device layer to form a first recess, thefirst recess having a shape of a first pattern; removing photoresistfrom the device layer; filling the first recess with non-crystallinesilicon (e.g., amorphous silicon) to form a shoulder; etching the devicelayer to define a waveguide; etching the shoulder, wherein the shoulderto align with the waveguide; covering the shoulder with cladding;applying photoresist on the cladding; etching the cladding to form asecond recess, the second recess having a shape of a second pattern;removing photoresist from the cladding; filling the second recess withnon-crystalline silicon, wherein: the non-crystalline silicon forms aridge of the waveguide mode expander; the shoulder is between thesubstrate and the ridge; and the ridge has a narrower width than theshoulder.

In some embodiments, etching the cladding uses a highly selective etchsuch that the cladding is more easily etched than the shoulder. In someembodiments, the second pattern comprises a triangle taper and/or aparabolic taper. Some embodiments further comprise: applying, whereinthe cladding is a first cladding, a second cladding on both the firstcladding and the non-crystalline silicon; etching the second cladding toform a third recess, the third recess having a shape of a third pattern;filling the third recess with additional non-crystalline silicon to forma second stage of the ridge, wherein filling the second recess formed afirst stage of the ridge. In some embodiments, the first stage is widerthan the second stage; and the second stage is thicker than the firststage. Some embodiments further comprise: applying, a third cladding thesecond cladding; etching the third cladding to form a fourth recess, thefourth recess having a shape of a fourth pattern; and filling the fourthrecess with additional non-crystalline silicon to form a third stage ofthe ridge. In some embodiments, amorphous silicon is converted topolycrystalline silicon.

In some embodiments, a waveguide mode expander comprises a substrate, ashoulder, and a ridge. The shoulder is disposed on the substrate, andthe shoulder is made of crystalline silicon. The ridge is made ofnon-crystalline silicon. The ridge is disposed on the shoulder such thatthe shoulder is between the ridge and the substrate. The ridge has anarrower width than the shoulder, wherein the ridge and the shoulder areconfigured to guide and expand an optical beam propagating through theshoulder and the ridge.

In some embodiments, the waveguide mode expander further comprisescladding disposed on the waveguide, wherein: the cladding has beenetched in a pattern to form a recess; and the ridge is formed by fillingthe recess with non-crystalline silicon. In some embodiments, the ridgehas a plurality of stages, and at a cross section of the waveguide modeexpander, each stage of the plurality of stages has a different width,and stages closer to the substrate have wider widths. In someembodiments, a stage closer to the substrate is thinner than a stagefarther from the substrate. In some embodiments, the ridge comprises onestage, three stages, and/or five stages. In some embodiments, claddingcovers the ridge and/or the shoulder. In some embodiments, the waveguidemode expander is fabricated using a silicon-on-insulator wafer. In someembodiments, the ridge comprises one or more tapers to expand an opticalbeam.

In some embodiments, a method for manufacturing a waveguide modeexpander is described. A substrate having a waveguide disposed on thesubstrate is provided. Cladding is deposited on the waveguide.Photoresist is applied on the cladding forming a pattern. A recess isetched in the cladding based on the pattern. Photoresist is removed, andthe recess is filled with non-crystalline silicon, wherein: thewaveguide forms a shoulder of the waveguide mode expander; thenon-crystalline silicon forms a ridge of the waveguide mode expander;the shoulder is between the substrate and the ridge; and the ridge has anarrower width than the shoulder.

Further areas of applicability of the present disclosure will becomeapparent from the detailed description provided hereinafter. It shouldbe understood that the detailed description and specific examples, whileindicating various embodiments, are intended for purposes ofillustration only and are not intended to necessarily limit the scope ofthe disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a perspective drawing of an embodiment of a single-stagemode expander.

FIG. 2 depicts a cross section of an input end of the single-stage modeexpander.

FIG. 3 depicts a cross section of an output end of the single-stage modeexpander.

FIGS. 4-6 depict simulations of mode confinement in mode expanders andan optical fiber.

FIG. 7 depicts a top view of an embodiment of a three-stage modeexpander.

FIGS. 8-12 depict cross sections of the three-stage mode expander.

FIGS. 13-18 depict cross sections of an embodiment of a five-stage modeexpander.

FIGS. 19-28 depict simplified sketches of the five-stage mode expanderduring fabrication.

FIG. 29 depicts an embodiment of a flowchart of a process formanufacturing a mode expander.

FIG. 30 depicts a graph showing simulated loss due to misalignmentbetween a single-stage mode expander and an optical fiber.

FIG. 31 depicts an optical mode confined in a three-stage mode expanderhaving a crystalline silicon shoulder and a non-crystalline siliconridge.

FIG. 32 depicts an optical mode confined in a three-stage mode expanderhaving a non-crystalline silicon shoulder and a non-crystalline siliconridge.

FIG. 33 is a plot of simulated mode divergence of a three-stage modeexpander.

FIGS. 34-39 depict views of an embodiment of forming a non-crystallinesilicon shoulder of a mode expander.

FIG. 40 depicts a top view of a three-stage mode expander with anon-crystalline silicon shoulder.

FIGS. 41-43 depict views of a single-stage mode expander with anon-crystalline silicon shoulder.

FIG. 44 shows a flowchart of an embodiment of a process for forming anon-crystalline silicon shoulder of a mode expander.

FIGS. 45-48 depict an embodiment of a multistage coupler for coupling afirst semiconductor waveguide with a second semiconductor waveguide.

In the appended figures, similar components and/or features may have thesame reference label. Further, various components of the same type maybe distinguished by following the reference label by a dash and a secondlabel that distinguishes among the similar components. If only the firstreference label is used in the specification, the description isapplicable to any one of the similar components having the same firstreference label irrespective of the second reference label.

DETAILED DESCRIPTION

The ensuing description provides preferred exemplary embodiment(s) only,and is not intended to limit the scope, applicability, or configurationof the disclosure. Rather, the ensuing description of the preferredexemplary embodiment(s) will provide those skilled in the art with anenabling description for implementing a preferred exemplary embodiment.It is understood that various changes may be made in the function andarrangement of elements without departing from the spirit and scope asset forth in the appended claims.

Embodiments generally relate to a mode expander for coupling asemiconductor waveguide (e.g., crystalline-silicon waveguide) to anoptical fiber.

Referring first to FIG. 1, a perspective drawing of an embodiment of asingle-stage mode expander 100 is shown. The single-stage mode expander100 comprises a shoulder 104 and a ridge 108. The single-stage modeexpander 100 has an input end 116 and an output end 118. In someembodiments, the input end 116 is coupled to a waveguide 120 having arectangular cross section. In some embodiments, the waveguide 120 has across section that is not rectangular (e.g., trapezoidal or inverted ‘T’shape with a crystalline-silicon ridge on top of a crystalline-siliconshoulder). The output end 118 is coupled with an optical fiber having around cross section (e.g., an optical fiber having normal or highNumerical Aperture (NA)).

In FIG. 1, both the shoulder 104 and the ridge 108 taper from the outputend 118 to the input end 116 so that an optical beam expands that istransmitted from the input end 116 to the output end 118. For example, abeam is transmitted from a waveguide 120 (e.g., a crystalline-siliconwaveguide), through the input end 116 of the single-stage mode expander100, through the output end 118 of the single-stage mode expander 100,and to an optical fiber having a larger core than the waveguide 120. Insome embodiments, as the beam propagates through the single-stage modeexpander 100, the beam expands adiabatically. A direction of beampropagation 124 is shown as an arrow going from the input end 116 to theoutput end 118. A person of skill in the art will recognize a beampropagating from the output end 118 to the input end 116 will becompressed.

FIG. 2 depicts a cross section of the single-stage mode expander 100 atthe input end 116 of the single-stage mode expander 100. Thesingle-stage mode expander 100 at the input end comprises the shoulder104, but not the ridge 108. The shoulder 104 has a thickness, St, and awidth, S_(w). The shoulder 104 has an input width, S_(w)-i, at the inputend 116. In some embodiments, the input width, S_(w)-i, of the shoulder104 ranges between 0.2 and 5 μm (e.g., 0.2, 0.5, 1, 2, 3, 4, or 5 μm).The thickness (sometimes referred to as height) of the shoulder 104ranges between 0.2 and 5 μm (e.g., 0.2, 0.5, 1.0, 1.5, 2, 3, or 5 μm).The shoulder 104 is made of crystalline silicon (c-Si). In someembodiments, the shoulder 104 is simply an extension of the waveguide120 fabricated on a substrate (e.g., a substrate comprising silicon oninsulator and/or SiO2). In some embodiments, the single-stage modeexpander 100 further comprises a substrate and/or cladding material.

FIG. 3 depicts a cross section of the single-stage mode expander 100 atthe output end 118 of the single-stage mode expander 100. The output end118 of the single-stage mode expander 100 comprises the shoulder 104 andthe ridge 108. The thickness St of the shoulder 104 remains relativelyconstant from the input end 116 to the output end 118. The width, S_(w),of the shoulder 104 expands to an output width, S_(w)-o, of the shoulder104. In some embodiments, the output width S_(w)-o of the shoulder 104ranges between 2 and 50+μm (e.g., 2, 3, 4, 5, 6, 8, 10, 25, or 50+μm).In some embodiments, the width S_(w)-o of the shoulder 104 at the outputend 118 is not critical because a beam is confined laterally (widthwise)by the ridge 108. Thus the width S_(w)-o of the shoulder 104 at theoutput end 118, in some embodiments, is greater than 4.5 μm. Put anotherway, in some embodiments mode confinement does not significantly changeif the width S_(w)-o of the shoulder 104 at the output end 118 is 5 μm,20 μm, 500 μm, or 1 meter.

The ridge 108, in FIG. 3, has only one stage. In some embodiments, theridge 108 comprises more than one stage, so that for a given crosssection perpendicular to beam propagation 124, the ridge 108 has varyingwidths for different stages (e.g., as discussed later in reference toFIGS. 10-18). The ridge 108 in the single-stage mode expander 100 has athickness, R_(t), and a width, R_(w). The thickness R_(t) of the ridge108 at the output end 118 is between 0.2 to 10 μm (e.g., 0.2, 0.5, 1, 2,3, 5, 7, or 10 μm). And in some embodiments, the width of the ridgeR_(w) ranges between 0.2 and 10 μm (e.g., 0.2, 0.5, 1, 2, 2.5, 3, 3.5,4, 5, 7, or 10 μm). Additionally, in some embodiments, a length of thesingle-stage mode expander 100, from the input end 116 to the output end118, is between 25 and 500 μm (e.g., 25, 50, 75, 100, 150, 200, 250,300, 400, or 500 μm).

The ridge 108, in some embodiments, is made of non-crystalline silicon.In crystalline silicon, a lattice structure is well defined. Innon-crystalline silicon, a lattice structure is not well defined.Examples of non-crystalline silicon include amorphous silicon (a-Si) andpolycrystalline silicon (poly-Si). In polycrystalline silicon, thelattice structure is not well defined, and a polycrystalline-siliconstructure comprises multiple crystal lattices. In some embodiments,though non-crystalline silicon may have more loss than crystallinesilicon, non-crystalline silicon is used for manufacturing reasons(e.g., for manufacturing tolerances and/or for expanding a beam largerthan a crystalline-silicon layer). Another advantage of non-crystallinesilicon, in some embodiments, is that non-crystalline has a stable andpredictable index of refraction that is similar to crystalline silicon(e.g., the ridge 108 has a first index of refraction; the shoulder 104has a second index of refraction; and the first index of refractionminus the second index of refraction is less than 0.05, 0.1, 0.2, or0.3). In some embodiments, the shoulder 104 is made of non-crystallinesilicon.

Referring next to FIGS. 4-6, simulations of mode confinements are shown.In FIG. 4, a simulated profile of a beam at the output end 118 of thesingle-stage mode expander 100 is shown. In some embodiments, a smallerbeam divergence angle and/or a larger spot size is preferred. Forexample, a beam divergence (half angle) of less than 30, 25, 20, 15, or10 degrees is targeted. In the simulation in FIG. 4, a beam divergenceof about 15 degrees was calculated. In FIG. 4, a spot size of 2.6 μm inthe vertical direction (y-axis) and about 2.8 μm in the horizontaldirection (x-axis) is shown (beam size being measured to 1/e² of peakintensity). In FIG. 5, a simulation of an optical beam confined in ahigh NA fiber is shown. In FIG. 6, a simulated profile of a beam at anoutput of a triple-stage mode expander is shown. In some embodiments,having a cross section roughly rectangular is targeted to assist inmatching an optical mode of a coupler with an optical mode of an opticalfiber.

Referring to FIG. 7, a top view of an embodiment of a three-stage modeexpander 700 is shown. The three-stage mode expander 700 comprises ashoulder 704 and a ridge 708. The ridge 708 further comprises a firststage 711, a second stage 712, and a third stage 713. An input end 716and an output end 718 are also shown. An optical beam is expanded goingfrom the input end 716 to the output end 718. Though FIG. 7 shows theridge 708 having three stages, other embodiments of mode expanders havefewer or more stages.

The shoulder 704, the first stage 711, the second stage 712, and thethird stage 713 taper from the output end 718 to the input end 716. InFIG. 7, the shoulder 704, the first stage 711, the second stage 712, andthe third stage 713 have a substantially isosceles-triangle shape tapers(e.g., z≈n|x|). In some embodiments, other taper shapes are used. Forexample, a taper could be substantially parabolic shaped (e.g., z≈x²; orz≈|x|^(n)), or substantially funnel shaped (e.g., z≈±ln(|x|); orz≈±log_(n)(|x|)), where n is not constrained to be an integer. Further,tapers for each stage could have a different shape. In FIG. 7, theshoulder 704 has a length, S_(L), the first stage 711 has a length,H_(L), the second stage 712 has a length, IL, and the third stage 713has a length, J_(L). In some embodiments, S_(L)=H_(L).

FIGS. 8-12 show cross sections of the three-stage mode expander 700going from the input end 716 (e.g., coupling to a semiconductorwaveguide) of the three-stage mode expander 700 to the output end 718(e.g., coupling to an optical fiber). In some embodiments, the firststage 711, the second stage 712, and the third stage 713 are made ofnon-crystalline silicon. In some embodiments, the shoulder 704 is madeof crystalline silicon. In some embodiments, the shoulder 704 is made ofnon-crystalline silicon. In some embodiments, the shoulder 704 is madeof crystalline silicon to reduce a manufacturing step (e.g., to not haveto replace some crystalline silicon with non-crystalline silicon). Insome embodiments, the shoulder 704 is made of non-crystalline silicon soa mode of an optical beam extends more into the shoulder 704 of thethree-stage mode expander 700.

FIG. 8 depicts a first cross section of the three-stage mode expander700 at the input end 716. FIG. 8 shows the shoulder 704. The shoulder704 in the first cross section has a first width, S_(w)-1, and athickness, St. In some embodiments, the input end 716 is coupled to thewaveguide 120. In some embodiments, the first width S_(w)-1 of theshoulder 704, and the thickness St of the shoulder 704, are equal to awidth of the waveguide 120 and a thickness of the waveguide 120,respectively. In some embodiments, the shoulder 704 is an extension ofthe waveguide 120. In some embodiments, the waveguide 120 is in a devicelayer of a silicon-on-insulator (SOI) wafer. In some embodiments, thethree-stage mode expander 700 further comprises a substrate and/orcladding material.

FIG. 9 depicts a second cross section of the three-stage mode expander700. The second cross section shows a starting of the first stage 711 ofthe three-stage mode expander 700. The first stage 711 of thethree-stage mode expander 700 has a first width, H_(w)-1, and athickness, H_(t). The first stage 711 is disposed on top of the shoulder704.

FIG. 10 depicts a third cross section of the three-stage mode expander700. The third cross section shows a starting of the second stage 712 ofthe three-stage mode expander 700. The second stage 712 of thethree-stage mode expander 700 has a first width, I_(w)-1, and athickness, I_(t). The first stage 711 of the three-stage mode expander700 has a second width H_(w)-2, which is wider than the first widthH_(w)-1 of the first stage 711. The shoulder 704 of the three-stage modeexpander 700 has a second width S_(w)-2, which is wider than the firstwidth S_(w)-1 of the shoulder 704.

FIG. 11 depicts a fourth cross section of the three-stage mode expander700. The fourth cross section shows a starting of the third stage 713 ofthe three-stage mode expander 700. The third stage 713 of thethree-stage mode expander 700 has a first width, J_(w)-1, and athickness, J_(t). The second stage 712 of the three-stage mode expander700 has a second width, I_(w)-2, which is wider than the first widthI_(w)-1 of the second stage 712. The first stage 711 of the three-stagemode expander 700 has a third width H_(w)-3, which is wider than thesecond width H_(w)-2 of the first stage 711. The shoulder 704 of thethree-stage mode expander 700 has a third width S_(w)-3, which is widerthan the second width S_(w)-2 of the shoulder 704.

FIG. 12 depicts a fifth cross section of the three-stage mode expander700. The fifth cross section of the three-stage mode expander 700 is across section of the output end 718 of the three-stage mode expander700. The third stage 713 of the three-stage mode expander 700 has asecond width, J_(w)-2, which is wider than the first width J_(w)-1 ofthe third stage 713. The second stage 712 of the three-stage modeexpander 700 has a third width, I_(w)-3, which is wider than the secondwidth I_(w)-2 of the second stage 712. The first stage 711 of thethree-stage mode expander 700 has a fourth width H_(w)-4, which is widerthan the third width H_(w)-3 of the first stage 711. The shoulder 704 ofthe three-stage mode expander 700 has a fourth width S_(w)-4, which iswider than the third width S_(w)-3 of the shoulder 704.

A table of dimensions of the shoulder 704 and of the ridge 708 in FIGS.7-12 is shown below. The ranges and values below are meant to beexemplary for the three-stage mode expander 700 in FIGS. 7-12, and notmeant to limit the scope of the invention. In some embodiments, rangesof dimensions below are used to adiabatically expand an optical modefrom a silicon waveguide to an optical fiber. In some embodiments,ranges below are used to adiabatically expand an optical mode from asilicon waveguide to an optical fiber in a compact distance to save roomon a chip.

Dimension Example Ranges (μm) Example Values (μm) S_(L)   50-1000;200-500 300, 350, 400 S_(t) 0.2-10; 1-4 1, 1-5, 2 S_(w)-1 0.1-10; 1-41.5, 2, 2.5, 3 S_(w)-2 0.1-10; 2-6 3, 4, 5 S_(w)-3  0.1-10; 3-10 4, 5,6, 7 S_(w)-4  0.1-12; 6-12 6.5, 7.5, 8.5 H_(L)   50-1000; 200-500 300,350, 400 H_(t)    0.2-10; 0.2-1.2 0.4, 0.6, 0.8, 1.0 H_(w)-1    0.1-10;0.2-1.2 0.4, 0.6, 0.8, 1.0 H_(w)-2 0.1-10; 1-4 2, 3, 4 H_(w)-3 0.1-10;2-8 3, 4, 5 H_(w)-4 0.1-11; 4-9 6, 6.5, 7, 7.4 I_(L)    25-750; 100-400200, 250, 300 I_(t)    0.2-10; 0.5-1.4 0.8, 1.2, 1.3, 1.4 I_(w)-1   0.1-10; 0.4-0.8 0.6, 0.7, 0.8 I_(w)-2  0.1-10; 1.5-6 2, 3, 3.5I_(w)-3 0.1-10; 3-8 4, 5, 6, 6.5 J_(L)   10-500; 50-250 140, 160, 180,200 J_(t) 0.2-10; 1-3 1.5, 1.7, 1.9, 2 J_(w)-1    0.1-10; 0.6-1.5 0.8,1.0, 1.2, 1.4 J_(w)-2 0.1-10; 2-6 4.5, 5.0, 5.5

Referring to FIGS. 13-18, cross sections of an embodiment of afive-stage mode expander are shown. The five-stage mode expander has ashoulder 1304 and a ridge. The ridge of the five-stage mode expander hasa first stage 1311, a second stage 1312, a third stage 1313, a fourthstage 1314, and a fifth stage 1315. FIGS. 13-18 show successive crosssections of the five-stage mode expander going from an input end 1316 ofthe five-stage mode expander (e.g., coupling to the waveguide 120)toward an output end 1318 of the five-stage mode expander (e.g.,coupling to an optical fiber). In some embodiments, the first stage1311, the second stage 1312, the third stage 1313, the fourth stage1314, and/or the fifth stage 1315 of the five-stage mode expander aremade of non-crystalline silicon.

FIG. 13 depicts a first cross section of the five-stage mode expander.The first cross section of the five-stage mode expander shows theshoulder 1304 of the five-stage mode expander. The first cross sectionof the five-stage mode expander is at the input end 1316. The shoulder1304 of the five-stage mode expander in the first cross section has afirst width, SHR_(w)-1, and a thickness, SHR_(t). In some embodiments,the input end 1316 is coupled to the waveguide 120. In some embodiments,the first width SHR_(w)-1 of the shoulder 1304, and the thicknessSHR_(t) of the shoulder 1304, are equal to the width of the waveguide120 and the thickness of the waveguide 120, respectively. In someembodiments, the shoulder 1304 is an extension of the waveguide 120. Insome embodiments, the waveguide 120 is in a device layer of asilicon-on-insulator (SOI) wafer. In some embodiments, the five-stagemode expander further comprises a substrate and/or cladding material. Insome embodiments, the shoulder 1304 is made of crystalline silicon toreduce a manufacturing step (e.g., to not have to replace somecrystalline silicon with non-crystalline silicon). In some embodiments,the shoulder 1304 is made of non-crystalline silicon so a mode of anoptical beam extends more into the shoulder 1304 of the five-stage modeexpander.

FIG. 14 depicts a second cross section of the five-stage mode expander.The second cross section shows a starting of the first stage 1311 of thefive-stage mode expander. The first stage 1311 of the five-stage modeexpander has a first width, A_(w)-1, and a thickness, A_(t). The firststage 1311 is disposed on top of the shoulder 1304.

FIG. 15 depicts a third cross section of the five-stage mode expander.The third cross section shows a starting of the second stage 1312 of thefive-stage mode expander. The second stage 1312 of the five-stage modeexpander has a first width, B_(w)-1, and a thickness, B_(t). The firststage 1311 of the five-stage mode expander has a second width A_(w)-2,which is wider than the first width A_(w)-1 of the first stage 1311. Theshoulder 1304 of the five-stage mode expander has a second widthSHR_(w)-2, which is wider than the first width SHR_(w)-1 of the shoulder1304.

FIG. 16 depicts a fourth cross section of the five-stage mode expander.The fourth cross section shows a starting of the third stage 1313 of thefive-stage mode expander. The third stage 1313 of the five-stage modeexpander has a first width, C_(w)-1, and a thickness, C_(t). The secondstage 1312 of the five-stage mode expander has a second width, B_(w)-2,which is wider than the first width B_(w)-1 of the second stage 1312.The first stage 1311 of the five-stage mode expander has a third widthA_(w)-3, which is wider than the second width A_(w)-2 of the first stage1311. The shoulder 1304 of the five-stage mode expander has a thirdwidth SHR_(w)-3, which is wider than the second width SHR_(w)-2 of theshoulder 1304.

FIG. 17 depicts a fifth cross section of the five-stage mode expander.The fifth cross section shows a starting of the fourth stage 1314 of thefive-stage mode expander. The fourth stage 1314 of the five-stage modeexpander has a first width, D_(w)-1, and a thickness, D_(t). The thirdstage 1313 of the five-stage mode expander has a second width, C_(w)-2,which is wider than the first width C_(w)-1 of the third stage 1313. Thesecond stage 1312 of the five-stage mode expander has a third width,B_(w)-3, which is wider than the second width B_(w)-2 of the secondstage 1312. The first stage 1311 of the five-stage mode expander has afourth width A_(w)-4, which is wider than the third width A_(w)-3 of thefirst stage 1311. The shoulder 1304 of the five-stage mode expander hasa fourth width SHR_(w)-4, which is wider than the third width SHR_(w)-3of the shoulder 1304.

FIG. 18 depicts a sixth cross section of the five-stage mode expander.The sixth cross section shows a starting of the fifth stage 1315 of themode expander. The fifth stage 1315 of the five-stage mode expander hasa first width, E_(w)-1, and a thickness, Et. The fourth stage 1314 ofthe five-stage mode expander has a second width, D_(w)-2, which is widerthan the first width D_(w)-1 of the fourth stage 1314. The third stage1313 of the five-stage mode expander has a third width, C_(w)-3, whichis wider than the second width C_(w)-2 of the third stage 1313. Thesecond stage 1312 of the five-stage mode expander has a fourth width,B_(w)-4, which is wider than the third width B_(w)-3 of the second stage1312. The first stage 1311 of the five-stage mode expander has a fifthwidth A_(w)-5, which is wider than the fourth width A_(w)-4 of the firststage 1311. The shoulder 1304 of the five-stage mode expander has afifth width SHR_(w)-5, which is wider than the fourth width SHR_(w)-4 ofthe shoulder 1304.

In some embodiments, S_(w)-1<S_(w)-2<S_(w)-3<S_(w)-4<S_(w)-5;A_(w)-1<A_(w)-2<A_(w)-3<A_(w)-4<A_(w)-5;B_(w)-1<B_(w)-2<B_(w)-3<B_(w)-4; C_(w)-1<C_(w)-2<C_(w)-3; andD_(w)-1<D_(w)-2. In some embodiments A_(t)<B_(t)<C_(t)<D_(t)<Et, and/orA_(w)>B_(w)>C_(w)>D_(w)>E_(w). In some embodiments, thicknesses ofstages is constrained: if the thickness of a stage is too great, themode doesn't adiabatically diverge vertically. If the thickness of thestage is too small it adds potentially unneeded steps to manufacturing.As the mode gets larger, thicker stages are tolerated. That is onereason why some embodiments have A_(t)<B_(t)<C_(t)<D_(t)<Et.Additionally, in some embodiments, a narrow tip width is desired (tipwidth being a most narrow portion of a stage), and the tip width of astage is limited by manufacturing capabilities. Similarly, in thethree-stage mode expander 700, in some embodiments, H_(t)<I_(t)<J_(t)and/or H_(w)>I_(w)>J_(w); and for mode expanders having more or lessthan three or five stages, widths of upper stages (stages farther from ashoulder) are thicker and/or narrower than lower stages (stages closerto a shoulder).

A table of dimensions of the shoulder 1304 and ridge in FIGS. 13-18 isshown below. The ranges and values below are meant to be exemplary forthe five-stage mode expander in FIGS. 13-18, and not meant to limit thescope of the invention. In some embodiments, ranges below are used toadiabatically expand an optical mode from a silicon waveguide to anoptical fiber (e.g., UHNA1 fiber from Nufern). In some embodiments, thefirst stage 1311 and the second stage 1312 have thicknesses are +/−100nm. In some embodiments, thickness of the third stage 1313, the fourthstage 1314, and the fifth stage 1315 (if present) vary by +/−200 nm. Insome embodiments, other tolerances are within 100 nm.

Dimension Example Ranges (μm) Example Values (μm) SHR_(t) 0.2-10; 1-4 1,1.5, 2 SHR_(w)-1 0.1-10; 1-4 2, 3, 4 SHR_(w)-2 0.1-10; 2-5 3.0, 3.5, 3.8SHR_(w)-3  0.1-10; 4-10 4, 5, 6 SHR_(w)-4  0.1-12; 6-12 7, 8, 9SHR_(w)-5  0.1-12; 10-15 11, 13, 15 A_(t)    0.2-10; 0.2-1.2 0.5, 0.6,0.8, 1.0 A_(w)-1    0.1-10; 0.4-1.2 0.6, 0.8, 1 A_(w)-2 0.1-10; 1-4 2.5,3, 3.5, 4 A_(w)-3 0.1-10; 3-9 3.5, 4.0, 4.5 A_(w)-4  0.1-11; 5-11 6, 7,8 A_(w)-5  0.1-12; 6-13 10, 11, 13 B_(t)    0.2-10; 0.5-1.4 0.8, 1.2,1.3, 1.4 B_(w)-1    0.1-10; 0.4-0.8 0.5, 0.6, 0.7 B_(w)-2 0.1-10; 2-63.0, 3.5, 4 B_(w)-3 0.1-10; 2-8 5, 6, 7 B_(w)-4  0.1-10; 6-13 9, 11, 12C_(t) 0.2-10; 1-4 1, 2, 3 C_(w)-1    0.1-10; 0.6-1.5 0.8, 1.0, 1.2, 1.4C_(w)-2 0.1-10; 4-6 4.5, 5, 5.5 C_(w)-3  0.1-12; 8-12 8, 10, 11 D_(t)0.2-10; 1-5 2, 3, 4 D_(w)-1 0.1-10; 1-2 1, 1.5, 2 D_(w)-2  0.1-11; 5-116, 7, 8.5 E_(t) 0.2-10; 2-7 4, 5, 6 E_(w)-1  0.1-10; 1.5-3 1.5, 2, 2.5,3

Referring next to FIGS. 19-28, simplified sketches of the five-stagemode expander during fabrication of the five-stage mode expander areshown. Similar techniques are used to manufacture the single-stage modeexpander 100, the three-stage mode expander 700, and mode expandershaving different number of stages. In FIG. 19, a waveguide 120 made ofcrystalline silicon is sandwiched between a substrate 1908 and a firstcladding layer 1904. The substrate 1908 comprises a buried-oxide (BOX)layer 1912 and a handle layer 1916. The waveguide 120 is made byprocessing a device layer of a silicon-on-insulator (SOI) wafer, whereinthe BOX layer 1912 and the handle layer 1916 are part of the SOI wafer.The BOX layer 1912 is made of SiO2, and the handle layer is made ofcrystalline silicon. In some embodiments, the BOX layer 1912 acts as alower cladding layer to the waveguide 120 and/or shoulder 1304. Thedirection of beam propagation 124, from left to right, is also shown. Asmentioned previously, the direction of beam propagation 124 is definedto facilitate explanation. A person of skill in the art will recognizethat mode expanders, such as the five-stage mode expander, can be usedin a reverse direction of the beam propagation 124 (e.g., to couplelight from an optical fiber to a silicon waveguide).

In some embodiments, the first cladding layer 1904 is made of SiO2. Thefirst cladding layer 1904 is polished (e.g., using chemical-mechanicalplanarization (CMP)) to a thickness equal to the thickness A_(t) of thefirst stage 1311 of the five-stage mode expander. The shoulder 1304 ofthe five-stage mode expander is also shown, contiguous with thewaveguide 120. In some embodiments, shoulder 1304 is formed whileforming the waveguide 120.

In FIG. 20, a first photoresist 2004 is placed in a first pattern on topof the first cladding layer 1904. The first pattern covers part of thefirst cladding layer 1904, but leaves part of the first cladding layer1904 exposed. The first pattern is used to form the first stage 1311, sothe first pattern will be similar to a top view of the first stage 1311.As mentioned previously, stages can have a linear taper (e.g., similarto an isosceles triangle), a funnel-shape taper, and/or anexponential-shaped taper. In some embodiments, photolithography methodsare used in placing photoresist layers (e.g., preparing the claddinglayer; applying the photoresist; aligning a mask; exposing photoresistto UV light; and removing photoresist exposed to the UV light).

In FIG. 21, a portion of the first cladding layer 1904 has been etchedto form a first recess 2104 in the first cladding layer 1904. Walls 2108of the first cladding layer 1904 form walls of the first recess 2104. Atop surface of the shoulder 1304 forms a bottom surface of the firstrecess 2104. The first recess 2104 has an outline in the shape of thefirst pattern. In some embodiments, a highly selective etch is used sothat etching through SiO2 of the first cladding layer 1904 happens morequickly than etching the shoulder 1304. In FIG. 22, the firstphotoresist 2004 is removed.

In FIG. 23, the first recess 2104 is filled with non-crystalline silicon2304, e.g., a-Si. In some embodiments, the first cladding layer 1904 isalso, partially or fully, covered with non-crystalline silicon 2304 toensure the first recess 2104 is completely filled.

In FIG. 24, a-Si is converted into poly-Si (e.g., by heating), andexcess poly-Si is removed (e.g., using CMP) so that the poly-Si has athickness equal to the first cladding layer 1904. In some embodiments, ahighly selective CMP process is used that polishes the poly-Si moreaggressively than SiO2 of the first cladding layer 1904. Polishing thepoly-Si finishes the first stage 1311 of the five-stage mode expander.

Successive stages are created by applying a cladding layer, opening arecess in the cladding layer, filling the opened recess in the claddinglayer with non-crystalline-silicon, and polishing thenon-crystalline-silicon to a height of the cladding layer. Thus a modeexpander can be created that has a finial height greater than a heightof a device layer of an SOI wafer. In some embodiments, the number ofstages made is a tradeoff between performance and manufacturability.Thus widths of stages are controlled by photolithography, and thicknesscontrolled by deposition, high-selectivity etching, and CMP. Thus, insome embodiments, this process provides a way to manufacture a modeexpander precisely with favorable manufacturing tolerances (e.g., ascompared to simply etching a mode expander from crystalline silicon).

To further illustrate successive stages being formed, FIGS. 25-29,provide illustrations of forming the second stage 1312 of the five-stagemode expander. In FIG. 25, a second cladding layer 2504 is deposited ontop of the first cladding layer 1904 and on top of the first stage 1311of the five-stage mode expander. The second cladding layer 2504 ispolished to the thickness B_(t) of the second stage 1312 of thefive-stage mode expander. FIG. 25 represents a start in making thesecond stage 1312 of the five-stage mode expander.

In FIG. 26, a second photoresist 2602 is placed in a second pattern ontop of the second cladding layer 2504. The second pattern covers part ofthe second cladding layer 2504, but leaves part of the second claddinglayer 2504 exposed. The second pattern is used to form the second stage1312 of the five-stage mode expander, so the second pattern will besimilar to a top view as the second stage 1312.

A portion of the second cladding layer 2504 has been etched to form asecond recess 2604 in the second cladding layer 2504. Walls 2608 of thesecond cladding layer 2504 form walls of the second recess 2604. A topsurface of the first stage 1311 forms a bottom surface of the secondrecess 2604. The second recess 2604 has an outline in the shape of thesecond pattern.

In FIG. 27, the second photoresist 2602 is removed and the second recess2604 is filled with non-crystalline silicon 2304, e.g., a-Si. In someembodiments, the second cladding layer 2504 is also covered withnon-crystalline silicon 2304 to ensure the second recess 2604 iscompletely filled.

In FIG. 28, a-Si is converted into poly-Si, and excess poly-Si isremoved so that the poly-Si has a thickness equal to the first claddinglayer 1904. In some embodiments, a highly selective CMP process is usedthat polishes the poly-Si more aggressively than SiO2 of the secondcladding layer 2504. Polishing the poly-Si finishes the second stage1312 of the five-stage mode expander. Similar steps are performed toform all five stages of the five-stage mode expander.

Referring to FIG. 29, a flowchart of an embodiment of a process 2900 formanufacturing a mode expander is shown. In step 2904 a cladding layer isdeposited (e.g., SiO2 as cladding for a waveguide). The cladding layeris polished to a predetermined height (e.g., using CMP), step 2908. Insome embodiments, the predetermined height is a height of a stage of themode expander. Polishing the cladding layer creates a flat surface. Instep 2912, photoresist is placed on the flat surface. In someembodiments, before photoresist is placed on the flat surface, a thinlayer of silicon nitride (Si₃N₄) is placed on the flat surface (e.g.,the thin layer of silicon nitride being 50, 75, 100, 125, 150, or 200 nmthick). The thin layer of silicon nitride is used as a stop layer forCMP polishing instead of SiO2, as discussed in step 2932. In step 2916,a recess is etched in the cladding layer.

In step 2920, photoresist is removed. In step 2924, the recess is filledwith a-Si. In some embodiments, the recess and the cladding layer areblanketed with a-Si. In some embodiments, only a portion of the claddinglayer is blanketed with a-Si when filling in the recess. In step 2928,the a-Si is optionally converted to poly-Si (e.g., by heat). In someembodiments, the a-Si is not converted into polysilicon. For example, at1330 and 1550 nm wavelengths, light has less attenuation in a-Si thanpolysilicon. Thus lower-temperature processes (e.g., lower than 400,500, and/or 600 degrees C.) are used so that not as much a-Si convertsinto polysilicon. In step 2932, a highly selective CMP polish is used toremove extra poly-Si so that the polysilicon does not exceed thepredetermined height (e.g., using the cladding layer or Si₃N₄ as a stoplayer for the highly-selective CMP polish).

In step 2936, a decision is made whether or not to add another stage. Ifthe answer is yes, then the process returns to step 2904. If the answeris no, then the process proceeds to step 2938. In Step 2938, an optionalfinal cladding layer is applied. In some embodiments, a final claddinglayer is applied to better confine a mode in the mode expander. In someembodiments, the final cladding layer covers the shoulder and/or theridge. In step 2940, the process ends.

In some embodiments, a mode expander is designed to reduce coupling losswhen end coupling a beam into an optical fiber (e.g., butt coupling). InFIG. 30, a graph shows simulated loss due to misalignment betweensingle-stage mode expander 100 (e.g., FIGS. 1 and 4) and the opticalfiber in FIG. 5. An x-axis shows misalignment measured in microns(misalignment measures an offset of the center of the single-stage modeexpander 100 to a center of the optical fiber in FIG. 5). A y-axis showsloss measured in decibels. The graph in FIG. 30 shows a loss less than 1dB for a 0.5 μm misalignment; a loss between 2 and 3 dB for a 1 μmmisalignment; a loss between 5 and 6 dB for a 1.5 μm misalignment; and aloss between 10 and 11 dB for a 2.0 μm misalignment.

FIG. 31 depicts an optical mode in a first three-stage mode expander700-1. The first three-stage mode expander 700-1 comprises the shoulder704 and the ridge 708 (which includes the first stage 711, the secondstage 712, and the third stage 713). The shoulder 704 of the firstthree-stage mode expander 700-1 is made of crystalline silicon. Theridge 708 is made of non-crystalline silicon.

FIG. 32 depicts an optical mode in a second three-stage mode expander700-2. The second three-stage mode expander 700-2 comprises the shoulder704 and the ridge 708 (which includes the first stage 711, the secondstage 712, and the third stage 713). The shoulder 704 of the secondthree-stage mode expander 700-2 is made of non-crystalline silicon. Theridge 708 of the second three-stage mode expander 700-2 is made ofnon-crystalline silicon.

Non-crystalline silicon can have a refractive index higher, perhapsslightly, than crystalline silicon. The difference between an index ofrefraction of non-crystalline silicon and crystalline silicon, in someembodiments, is caused during processing of a mode expander (e.g.,heating a-Si and/or chemicals used). A difference of index of refractioncan vary from fabrication unit to fabrication unit (e.g., usingdifferent temperatures and/or chemicals). Having differences in theindices of refraction between the shoulder 704 and the ridge 708 resultsin an optical mode being more tightly confined to the ridge 708, as seenin comparing the optical mode in the first three-stage mode expander700-1 in FIG. 31 to the optical mode in the second three stage modeexpander 700-2 in FIG. 32. Put another way, due to the higher refractiveindex of a-Si, a-Si placed on top of crystalline Si produces a confinedmode in the a-Si and results in a smaller optical mode than would resultif the shoulder 704 and the ridge 708 had identical indices ofrefraction. In some embodiments, a smaller optical mode limits couplingefficiency. Thus, in some embodiments, some or all of acrystalline-silicon shoulder and/or waveguide 120 is replaced withnon-crystalline silicon before forming a ridge (e.g., to preserve alarger mode). Therefore, in some embodiments, a mode expander has ashoulder and a ridge of the same material.

Referring to FIG. 33, a plot of calculated mode divergence of thethree-stage mode expander 700 at the output end 718 is shown. Thecalculated mode divergence is about 14 degrees horizontal, full-width,half-max (FWHM); and about 16 degrees Vertical FWHM. A beam having awavelength of 1310 nm has a beam width (horizontal) of about 4.6 μm anda beam height (vertical) of about 4.0 μm. A beam having a wavelength of1550 nm has a beam width (horizontal) of about 4.6 μm and a beam height(vertical) of about 4.0 μm.

Losses coupling to an optical fiber are estimated to be less than 1.8 dB(Taper<0.1 dB, Misalignment (0.5 μm)<0.5 dB, splicing <0.2 dB, a-Si (20dB/cm)<0.6 dB, epoxy gap (5 μm)<0.4 dB).

Referring to FIG. 34, a side view of an embodiment of a device layer3404 disposed on a substrate 3408 is shown. The substrate 3408 comprisesa BOX layer 3412 and a handle layer 3416. The device layer 3404 and thehandle layer 3416 are made of crystalline silicon. The device layer3404, BOX layer 3412, and the handle layer 3416 are part of an SOIwafer. In some embodiments, the device layer has a thickness (vertical)of 1.5 μm. A CMP stop 3420 is disposed on the device layer 3404. Anexample of a CMP stop 3420 is silicon nitride. The direction of beampropagation 124, from left to right is also shown.

Part of the device layer 3404 has been removed (e.g., etched) to form arecess 3424 in the device layer 3404. The part of the device layer 3404removed to form the recess 3424 has been performed to make anon-crystalline shoulder for a mode expander.

FIG. 35 is a top view of FIG. 34. In some embodiments, a width 3504 ofrecess 3424 is greater than a shoulder width. A width of non-crystallinesilicon can be reduced to a proper width later by etching.

FIG. 36 is a side view of an embodiment of a device with anon-crystalline shoulder 3604. The non-crystalline shoulder 3604 isformed by filling recess 3424 with non-crystalline silicon (e.g., a-Si).FIG. 37 is a top view of FIG. 36. Excess non-crystalline silicon isremoved by CMP. In some embodiments, non-crystalline shoulder 3604 isover etched so the non-crystalline shoulder 3604 has a height lower thanthe CMP stop 3420. An interface 3608 is formed between thenon-crystalline shoulder 3604 and the device layer 3404.

In FIGS. 38 and 39, the CMP stop 3420 is removed (e.g., by etching) andadditional portions of the device layer 3404 are etched (e.g., to theBOX layer 3412) to form a waveguide 120 in the device layer 3404 and/orin the non-crystalline shoulder 3604. Edges of the non-crystallineshoulder 3604 are also formed by etching.

Light travels from the waveguide 120, through the interface 3608, andinto the non-crystalline shoulder 3604. An optical path 3804 is shown bya dashed line. The interface 3608 is angled (e.g., not orthogonal to theoptical path 3804) with respect to the optical path 3804 to reducereflections in the waveguide 120 (e.g., back along the optical path3804). But in some embodiments, the interface 3608 is perpendicular tothe optical path 3804.

FIG. 40 shows a top view of an embodiment of the second three-stage modeexpander 700-2, after additional stages are added to the non-crystallineshoulder 3604.

Referring to FIGS. 41-43, an embodiment of a single-stage mode expander100 having an non-crystalline silicon shoulder is shown. FIGS. 41-43 aresimilar to FIGS. 1-3, except the shoulder 104 is made of non-crystallinesilicon (e.g., a-Si or poly-Si) instead of crystalline-silicon as theshoulder 104 in FIGS. 2-3.

Referring next to FIG. 44, an embodiment of a process 4400 of forming amode expander with a non-crystalline silicon shoulder is shown. Process4400 begins in step 4404 where a substrate is provided having a devicelayer made of crystalline-semiconductor material (e.g., crystallinesilicon). A portion of the device layer is removed and replaced withnon-crystalline, semiconductor material, step 4408. The non-crystalline,semiconductor material is not lattice matched to the device layer. Awaveguide is formed in the device layer and in the non-crystalline,semiconductor material, step 4412. In step 4416, process 4400 proceedsto step 2904 of FIG. 29.

The specific details of particular embodiments may be combined in anysuitable manner without departing from the spirit and scope ofembodiments of the invention. However, other embodiments of theinvention may be directed to specific embodiments relating to eachindividual aspect, or specific combinations of these individual aspects.

The above description of exemplary embodiments of the invention has beenpresented for the purposes of illustration and description. I_(t) is notintended to be exhaustive or to limit the invention to the precise formdescribed, and many modifications and variations are possible in lightof the teaching above. For example, many of the dimensions are based ona laser wavelength of 1310 nm propagating through a mode expander.Different dimensions can be used for different wavelengths of light. Forexample, if a width of 5 microns is used for 1310 nm light, a width of5.5 microns may be used for 1550 nm light. In some embodiments, a lengthof a stage remains constant for different wavelengths while widthsand/or thicknesses change. Different dimensions can also be used whencoupling to different off-chip devices, such as different types ofoptical fibers with different mode sizes and/or numerical apertures.

Further, all or part of a mode expander may be encapsulated in SiO2and/or other cladding material.

Additionally, though the examples given above couple an optical mode ofa silicon waveguide to an optical fiber, other features could befabricated using similar methods as those disclosed. For example, a modeexpander could be used to couple one silicon waveguide to a second,larger silicon waveguide. In another example, a first waveguide at afirst height is coupled to a second waveguide at a second height(non-crystalline silicon stages being used to move a mode verticallyover a horizontal distance in addition to, or instead of being used toexpand or contract a size of the mode). Thus waveguides can be made toguide a beam in three dimensions. Multiple waveguides can be layered,vertically, on one chip and combined with one another. In anotherexample, a mode expander couples a silicon waveguide to discrete opticsinstead of an optical fiber.

FIG. 45 depicts a side view of an example of an multistage coupler 4500used to optically couple a first waveguide 4504-1 at a first height witha second waveguide 4504-2 at a second height. In some embodiments, bothof the waveguides 4504 are semiconductor waveguides. In someembodiments, both of the waveguides 4504 are made of crystallinesilicon. The multistage coupler 4500 comprises a first stage 4508-1, asecond stage 4508-2, and a third stage 4508-3. Though, in someembodiments, fewer or more stages 4508 than three are used. The firststage 4508-1 is optically coupled to the first waveguide 4504-1. Thesecond stage 4508-2 is on top of the first stage 4508-1. The third stage4508-3 is on top of the second stage 4508-2. The third stage 4508-1 isoptically coupled to the second waveguide 4504-2. The second waveguide4504-2 is higher (vertically, e.g., farther from a substrate) than thefirst waveguide 4504-1.

An optical beam propagates from the first waveguide 4504-1, to the firststage 4508-1 and into the second stage 4508-2. The optical beam isguided into the second stage 4508-2, in part, because the first stage4508-1 tapers (narrows) as the first stage 4508-1 extends away from thefirst waveguide 4504-1. The second stage 4508-2 has a first taper(expanding) in a direction away from the first waveguide 4504-1, whichalso assists in guiding the optical beam from the first stage 4508-1into the second stage 4508-2.

The stages 4508 of the multistage coupler 4500 are manufactured similarto stages in mode expanders (e.g., using process 2900 in FIG. 29 and/orprocess 4400 in FIG. 44).

The optical beam is guided from the second stage 4508-2 and into thethird stage 4508-3 because of an expanding taper in the third stage4508-3 and/or a narrowing taper in the second stage 4508-2. The opticalbeam is coupled from the third stage 4508-3 into the second waveguide4504-2.

FIG. 46 depicts a top view of the first waveguide 4504-1 and the firststage 4508-1. The first waveguide 4504-1 is optically coupled to thefirst stage 4508-1 (e.g., using an angled interface 4604). In someembodiments, the first stage 4508-1 is formed by removing a portion ofthe first waveguide 4504-1 (or device-layer material), similar toforming a non-crystalline silicon shoulder of a mode expander. In someembodiments, the first stage 4508-1 is not used and the second stage4508-2 is disposed on top of the first waveguide 4504-1; light is guidedinto the second stage 4508-2 from the first waveguide 4504-1 because ofa difference in index of refraction (e.g., similar to FIG. 31 of a modeexpander having a crystalline shoulder).

FIG. 47 depicts a top view of the second stage 4508-2. The second stage4508-2 comprises a first taper 4704-1 and a second taper 4704-2. Thefirst taper 4704-1 expands going from the first waveguide 4504-1 towardthe second waveguide 4504-2. The second taper 4704-2 narrows going fromthe first waveguide 4504-1 toward the second waveguide 4504-2.

FIG. 48 depicts a top view of the third stage 4508-3 and the secondwaveguide 4504-2. The third stage 4508-3 is optically coupled to thesecond waveguide 4504-2.

In some embodiments, a multistage coupler (e.g., multistage coupler4500) for coupling a first waveguide 4504-1 with a second waveguide4504-2 comprises a first stage 4508-1, a second stage 4508-2, and athird stage 4508-3, wherein the first stage 4508-1 is coupled with afirst waveguide 4504-1; the second stage 4508-2 is, at least partially,on top of the first stage 4508-1 (e.g., farther from a substrate thanthe first stage 4508-1); the third stage 4508-3 is, at least partially,on top of the second stage 4508-2; the third stage 4508-3 is opticallycoupled to the second waveguide 4504-2; and the first stage 4508-1, thesecond stage 4508-2, and the third stage 4508-3 are configured to guidean optical beam (e.g., adiabatically and/or vertically) from the firstwaveguide 4504-1 to the second waveguide 4504-2. In some embodiments,the multistage coupler 4500 guides the optical beam horizontally as wellas vertically.

In some embodiments, the first waveguide 4504-1 is made of silicon andthe second waveguide 4504-2 is made of a different material, such as aIII-V compound or II-VI compound (e.g., InP, GaAs). In some embodiments,the different material and the first waveguide 4504-1 are integrated ona silicon chip. For example, a III-V chip is secured on a siliconsubstrate as described in U.S. patent application Ser. No. 14/509,914,filed on Oct. 8, 2014.

The embodiments were chosen and described in order to explain theprinciples of the invention and its practical applications to therebyenable others skilled in the art to utilize the invention in variousembodiments and with various modifications as are suited to theparticular use contemplated.

Also, it is noted that the embodiments may be described as a processwhich is depicted as a flowchart, a flow diagram, a data flow diagram, astructure diagram, or a block diagram. Although a flowchart may describethe operations as a sequential process, many of the operations can beperformed in parallel or concurrently. In addition, the order of theoperations may be re-arranged. A process is terminated when itsoperations are completed, but could have additional steps not includedin the figure. A process may correspond to a method, a function, aprocedure, a subroutine, a subprogram, etc.

A recitation of “a”, “an”, or “the” is intended to mean “one or more”unless specifically indicated to the contrary.

All patents, patent applications, publications, and descriptionsmentioned here are incorporated by reference in their entirety for allpurposes. None is admitted to be prior art.

What is claimed is:
 1. A multistage coupler that shifts a height of anoptical beam relative to a substrate, comprising: the substrate, whereinthe substrate defines an upper surface; a lower cladding layer; a firststage and a final stage, wherein: the first stage is formed of amorphoussilicon or polysilicon, and has a higher index of refraction than thelower cladding layer; the first stage forms an input end that isconfigured to receive the optical beam from an input waveguide thatpropagates the optical beam along a propagation direction; the lowercladding layer is disposed between the first stage and the uppersurface; the first stage is disposed at a first height, relative to theupper surface, from the input end to a first-stage end; the first stageforms a first-stage cross section, transverse to the propagationdirection, that tapers along the propagation direction, wherein thefirst-stage end is narrower than the input end; the first stage isoptically coupled with the final stage; the final stage forms an outputend that is configured to transmit the optical beam into an outputwaveguide at a second height relative to the upper surface; the finalstage is formed of amorphous silicon or polysilicon, and has a higherindex of refraction than the lower cladding layer; the final stage isdisposed at the second height relative to the upper surface from afinal-stage end to the output end, the second height being greater thanthe first height; the final stage forms a final-stage cross section,transverse to the propagation direction, that widens along thepropagation direction, wherein the output end is wider than thefinal-stage end; the input waveguide is formed of crystalline silicon,and is disposed above the lower cladding layer; and the input waveguideis configured to transmit the optical beam into the input end of thefirst stage.
 2. The multistage coupler of claim 1, wherein thefirst-stage cross section at the input end of the first stage supportsan optical mode of an initial mode size, and the final-stage crosssection at the output end of the final stage supports an optical mode ofa final mode size that is the same as the initial mode size.
 3. Themultistage coupler of claim 1, wherein the first-stage cross section atthe input end of the first stage supports an optical mode of an initialmode size, and the final-stage cross section at the output end of thefinal stage supports an optical mode of a final mode size that isdifferent from the initial mode size.
 4. The multistage coupler of claim1, further comprising an upper cladding layer, wherein: the first stageand the final stage are disposed between the upper cladding layer andthe upper surface, the upper cladding layer has a lower index ofrefraction than both the first stage and the final stage.
 5. Themultistage coupler of claim 1, further comprising the output waveguide,wherein: the output waveguide is formed of crystalline silicon, a III-Vcompound or a II-VI compound; and the output waveguide is configured toreceive the optical beam from the output end of the final stage.
 6. Amultistage coupler that shifts a height of an optical beam relative to asubstrate, comprising: the substrate, wherein the substrate defines anupper surface; a lower cladding layer; a first stage, an intermediatestage, and a final stage, wherein: the first stage is formed ofamorphous silicon or polysilicon, and has a higher index of refractionthan the lower cladding layer; the first stage forms an input end thatis configured to receive the optical beam from an input waveguide thatpropagates the optical beam along a propagation direction; the lowercladding layer is disposed between the first stage and the uppersurface; the first stage is disposed at a first height, relative to theupper surface, from the input end to a first-stage end; the first stageforms a first-stage cross section, transverse to the propagationdirection, that tapers along the propagation direction, wherein thefirst-stage end is narrower than the input end; the first stage isoptically coupled with the final stage; the intermediate stage is formedof amorphous silicon or polysilicon, and is in direct physical contactwith the first stage, with no intervening material therebetween; theintermediate stage is disposed at a second height relative to the uppersurface; the second height is greater than the first height; the finalstage forms an output end that is configured to transmit the opticalbeam into an output waveguide at a third height relative to the uppersurface; the final stage is formed of amorphous silicon or polysilicon,and has a higher index of refraction than the lower cladding layer; thefinal stage is disposed at the third height relative to the uppersurface from a final-stage end to the output end, the third height beinggreater than the second height; and the final stage forms a final-stagecross section, transverse to the propagation direction, that widensalong the propagation direction, wherein the output end is wider thanthe final-stage end.
 7. The multistage coupler of claim 6, wherein: theintermediate stage defines an intermediate-stage cross section,transverse to the propagation direction, and the intermediate-stagecross section widens or narrows along the propagation direction.
 8. Themultistage coupler of claim 7, wherein: the intermediate stage definesan intermediate stage beginning, an intermediate stage middle portionand an intermediate-stage end, the intermediate stage beginning couplesoptically with the first stage; the intermediate-stage cross sectionforms a first taper that widens along the propagation direction from theintermediate stage beginning to the intermediate stage middle portion;the intermediate-stage end couples optically with the final stage; andthe intermediate-stage cross section forms a second taper that narrowsalong the propagation direction from the intermediate stage middleportion to the intermediate-stage end.
 9. The multistage coupler ofclaim 6, wherein the final stage is in direct contact with theintermediate stage, with no intervening material therebetween, and theoptical beam propagates directly from the intermediate stage into thefinal stage.
 10. The multistage coupler of claim 6, wherein theintermediate stage comprises a first intermediate stage and a secondintermediate stage, each of the first and second intermediate stagesbeing formed of amorphous silicon or polysilicon.
 11. A method ofshifting a height of an optical beam relative to a substrate,comprising: receiving the optical beam at an input end of a multistagecoupler that is coupled with the substrate, wherein the input end of themultistage coupler defines a first height relative to an upper surfaceof the substrate; propagating the optical beam through the multistagecoupler, wherein the multistage coupler comprises a first stage and afinal stage, and wherein: the first stage is disposed at the firstheight, relative to the upper surface, from the input end to afirst-stage end, the first stage is formed of amorphous silicon orpolysilicon, and tapers along a propagation direction that extends fromthe input end to the first-stage end, the first-stage end is narrowerthan the input end, the first stage is optically coupled with the finalstage, the final stage is disposed at a second height relative to theupper surface from a final-stage end to an output end of the multistagecoupler, the second height being greater than the first height, thefinal stage is formed of amorphous silicon or polysilicon, and widensalong the propagation direction, wherein the output end is wider thanthe final-stage end, and propagating the optical beam comprises at leastone of: propagating the optical beam from an input waveguide into thefirst stage at an angled interface between the input waveguide and thefirst stage, or propagating the optical beam from the final stage intoan output waveguide at an angled interface between the final stage andthe output waveguide; and transmitting the optical beam through theoutput end of the multistage coupler.
 12. The method of claim 11,wherein receiving the optical beam at the input end of the multistagecoupler comprises propagating the optical beam with an initial modesize, and transmitting the optical beam through the output end of themultistage coupler comprises propagating the optical beam with a finalmode size that is the same as the initial mode size.
 13. The method ofclaim 11, wherein receiving the optical beam at the input end of themultistage coupler comprises receiving the optical beam with an initialmode size, and transmitting the optical beam through the output end ofthe multistage coupler comprises transmitting the optical beam with afinal mode size that is different from the initial mode size.
 14. Themethod of claim 11, further comprising propagating the optical beam intoan optical fiber, wherein the optical beam does not change in heightrelative to the upper surface as the optical beam propagates from theoutput end of the multistage coupler into the optical fiber.
 15. Themethod of claim 11, wherein receiving the optical beam at the input endof the multistage coupler comprises transmitting the optical beam from awaveguide formed of crystalline silicon into the input end, and furthercomprising propagating the optical beam through the output end of themultistage coupler and into a waveguide formed of crystalline silicon.16. The method of claim 11, further comprising propagating the opticalbeam through the output end of the multistage coupler and into awaveguide formed of a III-V compound or a II-VI compound.
 17. The methodof claim 11, wherein propagating the optical beam through the multistagecoupler comprises: propagating the optical beam directly from the firststage into an intermediate stage, wherein: the intermediate stage isformed of amorphous silicon or polysilicon, and is in direct physicalcontact with the first stage, with no intervening material therebetween,the intermediate stage is disposed at a third height relative to theupper surface, and the third height is intermediate in height betweenthe first height and the second height, relative to the upper surface.18. The method of claim 17, wherein: propagating the optical beamthrough the multistage coupler comprises propagating the optical beamdirectly from the intermediate stage into the final stage; and theintermediate stage is in direct physical contact with the final stage,with no intervening material therebetween.
 19. The multistage coupler ofclaim 1, wherein the first stage is in direct physical contact with thefinal stage, with no intervening material therebetween, so that theoptical beam propagates directly from the first stage into the finalstage.
 20. The multistage coupler of claim 1, further comprising anintermediate stage between the first stage and the final stage, wherein:the intermediate stage is disposed at a third height relative to theupper surface, and the third height is intermediate in height betweenthe first height and the second height, relative to the upper surface.